High density analog interface
US6384753B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2001 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | May 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03M1/18
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An interface module includes a high density analog interface (HAI) for electrical interconnection between a programmable logic controller (PLC) and an analog to digital converter (ADC) or a digital to analog converter (DAC). The HAI includes a single application specific integrated circuit having a data scaling function block, a diagnostics function block configured to verify functionality of said scaling function block, a self-calibration function block configured to compensate for drift in said ADC, and a shared interface function block configured to electronically connect said module with a programmable logic controller (PLC).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.