Heat sink assembly having inner and outer heatsinks
US6385046B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2000 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Sep 14, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink structure includes a heat emitting component, an inner heat sink in thermal contact with the heat emitting component, a cabinet of a computer system in thermal contact with the inner heat sink, and an outer heat sink in thermal contact with the cabinet. The cabinet defines an outer region outside of the computer system and an inner region inside of the computer system. Generally, the outer region is cooler than the inner region. Advantageously, since the outer heat sink is located in the outer region, the outer heat sink is relatively cool compared to the heat emitting component. This drives heat from the heat emitting component through the inner heat sink and the cabinet to the outer heat sink, which dissipates this heat to the outer region outside of the computer system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.