EMI reduction device and assembly
US6385048B2 · kind B2 · utility
16Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2001 |
| Grant date | May 7, 2002 |
| Priority date | — |
| Expiry date | Jan 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An EMI reduction device is interposed between a printed circuit board (PCB) assembly and a heat sink. The PCB assembly includes a processor core that is the source of unintentional electromagnetic interference (EMI). The EMI reduction device contacts a heat sink which is positioned over the processor core such that it capacitively couples emissions from the processor core to a grounding plane resident in the PCB assembly, thereby reducing the unintentional EMI. Simultaneously, the EMI reduction device is able to maintain thermal contact with the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.