Piercing pin structure and attachment for higher density ribbon cable
US6386901B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 2000 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Jun 16, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/616
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connector and pin structure for coupling with a higher density, finer conductor pitch ribbon cable or the like is disclosed. The connector has an array of pins disposed thereon where a beveled tip of the pin allows for the pin to penetrate the insulation sheath of a corresponding conductor, and the pins have a contacting structure that facilitates contact between the pin and the conductor. In one embodiment, such as where the conductor comprises a braided conductor, each pin has a bulge structure that allows for optimal contact between the pin and the conductor. In another embodiment, such as where the conductor comprises a braided conductor or a solid wire conductor, the pin is asymmetrical and has a notch structure that allows for optimal contact between the pin and the conductor. In an embodiment where the ribbon cable has two layers, a first subset of the array of pins contacts the first layer, and a second subset of the array of pins contacts the second layer with the position of the contact structure corresponds to the position of the respective layer of the cable. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.