Dual cure, low-solvent silicone pressure sensitive adhesives
US6387487B1 · kind B1 · utility
33Cited by
31References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2000 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Oct 12, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A pressure sensitive adhesive composition includes an alkenyl-terminated polydiorganosiloxane, a silanol-terminated polydiorganosiloxane, a resinous copolymer, an organohydrogenpolysiloxane with terminal Si—H groups, a hydrosilation catalyst, and an organic cross-linking agent. The composition provides excellent high temperature adhesion properties and enables coatable formulations with low solvent content.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.