Electroless silver plating
US6387542B1 · kind B1 · utility
41Cited by
6References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2000 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Jul 6, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12896
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to electroless plating of silver onto a substrate, an aqueous silver plating bath, a process for plating a uniform coating of silver onto various substrates using an electroless plating composition, and a silver plated article formed therefrom. The plating bath neither contains nor generates toxic or flammable substances or substances that may contaminate the silver coating. By avoiding strong complexing agents, virtually pure silver may be precipitated from the bath by simple boiling. Silver electroless autocatalytic plating bath consists of silver nitrate, ammonium hydroxide and hydrazine hydrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.