Time-based semiconductor material attachment
US6387733B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2001 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | May 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07802
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention controls attachment of a first semiconductor material, such as a semiconductor die, to a second semiconductor material, such as a bond pad, substrate, or the like. A placement tool is used to pick up the first semiconductor material and move it to a defined position above the top surface of the second semiconductor material. The second semiconductor material will have an adhesive, such as epoxy, applied to its top surface. From the defined position above the second semiconductor material, the placement tool is allowed to fall for an amount of time previously determined to result in an adhesive layer of a defined thickness, within precise tolerances. The adhesive thickness is often referred to as bond line thickness (BLT) when bonding a semiconductor die to a bond pad, substrate, or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.