Patent · US Expired

Lithographic template and method of formation and use

US6387787B1 · kind B1 · utility

70Cited by
1References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 2, 2001
Grant dateMay 14, 2002
Priority date
Expiry dateMar 2, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31507
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

This invention relates to semiconductor devices, microelectronic devices, micro electro mechanical devices, microfluidic devices, and more particularly to a lithographic template, a method of forming the lithographic template and a method for forming devices with the lithographic template. The lithographic template (10) is formed having a substrate (12), an optional etch stop layer (16) formed on a surface (14) of the substrate (12), and a patterning layer (20) formed on a surface (18) of the etch stop layer (16). The template (10) is used in the fabrication of a semiconductor device (30) for affecting a pattern in device (30) by positioning the template (10) in close proximity to semiconductor device (30) having a radiation sensitive material formed thereon and applying a pressure to cause the radiation sensitive material to flow into the relief image present on the template. Radiation is then applied through the template so as to further cure portions of the radiation sensitive material and further define the pattern in the radiation sensitive material. The template (10) is then removed to complete fabrication of semiconductor device (30).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.