Solvent-free film-forming compositions, coated substrates and method related thereto
US6387997B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1999 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Nov 10, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D151/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An aqueous dispersion including polymeric microparticles which are prepared in a medium substantially free of organic solvent from a mixture of one or more reaction products of polymerizable, ethylenically unsaturated monomers, and one or more reactive organopolysiloxanes is provided. Pigmented film-forming compositions, curable compositions and topcoats of multi-component composite coating composition containing the above-described dispersions also are provided. The substantially solvent-free film-forming compositions of the invention are storage stable at room temperature and provide coatings with excellent application properties such as sag resistance and tack-free overspray, and excellent performance properties such as hardness and scratch resistance. The film-forming compositions are suitable for wet-on-wet application over a base coat with little or no mudcracking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.