Multi layer printed circuit board
US6388202B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1997 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Oct 6, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0358
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high density multi-layer printed circuit board (100) is formed by building additional dielectric and metallization layers over a central core (110) of conventional PCB laminate construction. The central core has a metallization pattern (113, 114) on at least one surface. A photoimaged dielectric layer (130) is deposited on one side of the central core and overlies the metallization pattern. Vias (136) are formed in this dielectric layer by a photoimaging process, and an additional metallization pattern (133) on this layer is electrically connected to the underlying metallization pattern through these vias. A non-photoimageable dielectric layer (120) is deposited on the other side of the central core. Vias (126) are formed in this dielectric layer by a laser drilling process, and an additional metallization pattern (123) on this layer is electrically connected to an underlying metallization pattern through these laser drilled vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.