Multi-connection via with electrically isolated segments
US6388208B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 1999 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Jul 23, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0455
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnection circuit and related techniques are described. The interconnection circuit includes a plated through hole having a plurality of electrically isolated segments with at least one of the plurality of electrically isolated segments coupled to a signal path and at least one of the electrically isolated segments coupled to ground. With this arrangement, the circuit provides a signal path between a first and a second different layers of a multilayer. By providing one segment as a signal segment and another segment as a ground segment the size and shape of the electrically isolated segments can be selected to provide the interconnection circuit having a predetermined impedance characteristic. The interconnection circuit can thus be impedance matched to circuit board circuits, devices and transmission lines, such as striplines, microstrips and co-planar waveguides. This results in an interconnection circuit which maintains the integrity of relatively high-frequency signals propagating through the interconnection circuit from the first layer to the second layer. The interconnect circuits can be formed by creating distinct conductor paths within the cylindrical plated throug…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.