Systems and methods for controlling depths of a laser cut
US6388231B1 · kind B1 · utility
26Cited by
23References
37Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 15, 2000 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Jul 18, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process for precision patterning or cutting of a sheet stock, such as an adhesive tape, includes the step of irradiating a surface of a sheet stock with an irradiation source to pattern or cut a part in the sheet stock and adjusting at least one of a beam width and the power of the irradiation source to form a cut in the sheet stock to a controlled depth. The method is particularly useful for precision cutting adhesive members, such as adhesive fluid seals, for an inkjet print cartridge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.