Semiconductor device
US6388311B1 · kind B1 · utility
44Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1999 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Dec 6, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device capable of preventing moisture from entering into a package and also capable of preventing peeling between a pad and the package from occurring.The semiconductor device comprises grooves formed on a semiconductor element mounting surface of the pad to surround the semiconductor element, plated portions formed on only a ground bond area of the semiconductor element mounting surface of the pad, a thin portion formed on an entire peripheral edge portions on the back of the pad, and thin portions formed at portions which connect with the pad, on backs of support bars extending from the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.