Semiconductor module
US6388316B1 · kind B1 · utility
3Cited by
3References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 17, 2001 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Apr 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Providing a semiconductor module comprising a plurality of semiconductor elements, in which wiring lengths of the semiconductor elements juxtaposed to each other are approximately the same. A semiconductor module comprising a lower layer substrate and an upper layer substrate, in which a first and a second electrode pads formed in a front surface of the lower layer substrate are connected with a first and a second wires by a first and a second bridge wires disposed in a back surface of the upper layer substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.