Bond pad having reduced capacitance and method for reducing capacitance of a bond pad
US6388331B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 2000 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Feb 16, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bond pad having reduced capacitance is disclosed which is useful in fabricating integrated circuit and communications devices. The bond pad is disposed within a select bond pad area and comprises a ribbon of conductive material within the select pad area and a two-phased region of air and conductive material. Also, at least one interconnect area is disposed within the bond pad area. The ribbon is coupled to the two-phased region, and the interconnect is coupled to the ribbon and to the device. Inclusion of air within the bond pad structure reduces the capacitance of the device, while the surface area of the bonding pad is maintained to at least substantially retain the adhesive properties of the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.