Antenna-integrated microwave-millimeter wave module
US6388623B1 · kind B1 · utility
30Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2001 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Apr 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A microwave circuit or a millimeter wave circuit is formed on a semiconductor chip. A multilayer substrate is formed of a first dielectric layer, a second dielectric layer and a third dielectric layer. A high-frequency circuit line with the semiconductor chip mounted thereon is formed on the third dielectric layer. A slot hole is formed on one side of the second dielectric layer and an antenna feeding line is formed on the other side. The first dielectric layer has a plurality of slot holes formed therein that radiate electromagnetic waves. An organic substrate is laminated to the multilayer substrate by an adhesion layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.