Integrated thermal architecture for thermal management of high power electronics
US6388882B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2001 |
| Grant date | May 14, 2002 |
| Priority date | — |
| Expiry date | Jul 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20536
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a thermal energy management architecture for a functioning system of electronic components and subsystems comprising a hierarchical scheme in which thermal management components are: (i) operatively engaged with individual portions of the system of electronic components and subsystems, in multiple defined levels and (ii) substantially only thermally driven, i.e., heat transfer devices that have no moving parts and require no external power for their operations. In one embodiment thermal management devices and technologies are divided into five separate levels within a functioning electronics system. In another embodiment, a sixth level is provided for bypassing one or more of the five levels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.