Apparatus and method for mounting electronic component
US6389683B1 · kind B1 · utility
11Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 1999 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Oct 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53183
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solvent transfer unit is made a slide type and a plurality of nozzles at a head part which suck and hold components are moved down simultaneously to transfer the flux to electronic components. In comparison with an electronic component mounting method including a transfer operation whereby nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent transfer unit, a time for moving the nozzles up, down is shortened and a total cycle time is reduced, so that production efficiency is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.