Method and apparatus for producing beneficial stresses around apertures by use of focused stress waves
US6389865B1 · kind B1 · utility
8Cited by
22References
52Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 16, 1999 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Mar 16, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D2221/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Tooling and a method of employing tooling to produce beneficial stress waves in a substrate to provide high fatigue life structures. Stress waves are provided to work a substrate, causing dimples in the workpiece, along a uniform pressure profile in the workpiece. By use of the method, uniform beneficial residual stress is provided at surface and midplane apertures in a workpiece, so as to improve overall fatigue life. An improved tool shape is described, having a smooth curve, rather than a flat punch. Also, the use of a consumable wafer provides additional uniform stress profile benefits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.