Method for forming a metallic contact on an electronic printed circuit board and a product therefrom
US6390355B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 3, 1999 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Sep 3, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for forming a metallic contact and manufacturing a product having an electronic component 101 and a printed circuit board 100 (PCB) includes dispensing a slurry solder paste mixture 104 including a metallic powder 105 and an acidic fluid 106, placing electronic component 101 over solder paste dispensed over a surface area of PCB 100, and applying pressure on at least a section of electronic component 101 such that at least a portion of slurry solder paste mixture 104 dispensed on the surface area and in contact with the section of electronic component 101 consolidates into at least one of an inter-metallic compound of hardened solder and a hardened alloy of solder forming the metallic contact between electronic component 101 and said PCB 100.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.