Nozzle and adjust module
US6390394B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Dec 4, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/08
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention relates to a nozzle and adjust module of chemicals when wafers are processed during the IC manufacturing process. After wafers are loaded on a chuck of a reaction chamber, five chemicals required for the manufacturing process are transported into the passages, and are sprayed on the surfaces of rotating wafers via different nozzles. The centrifugal effect due to the rotation of a main motor is exploited to coat the chemicals on the whole wafer quickly and uniformly. The present invention can apply to both closed and open reaction chambers. The spray head of the present invention has a specially designed angle, and has level adjusting and height adjusting functions so that high flexibility in the manufacturing process can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.