Finishing semiconductor wafers with a fixed abrasive finishing element
US6390890B1 · kind B1 · utility
63Cited by
61References
27Claims
0Family size
Inventor
Key dates
| Filing date | Feb 3, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Feb 3, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S451/921
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A fixed abrasive finishing element having a continuous phase of synthetic resin and discrete synthetic resin particles dispersed in the continuous phase of synthetic resin is described. The synthetic resin particles have abrasive particles dispersed therein. A compatibilizing agent can be used to enhance their finishing properties. The finishing elements are useful for polishing semiconductor wafers. Planarization and localized finishing can be improved using these finishing elements. Unwanted surface defects can be reduced. Methods to finish a semiconductor wafer using these finishing elements are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.