Patent · US Expired

Method and device for cutting a multiplicity of disks from a hard brittle workpiece

US6390896B1 · kind B1 · utility

20Cited by

9References

8Claims

0Family size

Assignee

Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

Anton Huber · Burghausen, DE
Joachim Junge · Burghausen, DE
Jorg Moser · Altötting, DE

Key dates

Filing date	Sep 1, 1999
Grant date	May 21, 2002
Priority date	—
Expiry date	Sep 1, 2019

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB28D5/045
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method for cutting a multiplicity of disks from a hard brittle workpiece is by moving the workpiece at a defined feed rate through a wire web of a wire saw. In the method, the wire web is formed by a sawing wire which moves in a reciprocating manner and is covered with bonded abrasive grain. A cooling liquid is provided beneath the wire web, in which cooling liquid the sawing wire of the wire web is immersed when cutting off the disks. Also provided is a wire saw which is suitable for carrying out the method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.