Method for making an electrical circuit board
US6391211B1 · kind B1 · utility
2Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Sep 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0323
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for making multi-layer electronic circuit board including a pre-circuit assembly 12 and a ground layer 14 which are automatically aligned and bonded together by use of solder material or deposits 26, 28.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.