Patent · US Expired

Methods and apparatus for forming submicron patterns on films

US6391217B2 · kind B2 · utility

104Cited by
1References
26Claims
0Family size

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Key dates

Filing dateDec 22, 2000
Grant dateMay 21, 2002
Priority date
Expiry dateDec 22, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/24521
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A method for forming a patterned film on a substrate, the method including: providing a first flowable medium on the substrate and a second flowable medium on the first flowable medium, the first and second flowable media having different dielectric properties and defining an interface there between; applying an electric field to the interface for a time sufficient to produce a structure in the first flowable medium along the interface; and hardening the structure in the first flowable medium to form the patterned film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.