Methods for fabricating flexible circuit structures
US6391220B1 · kind B1 · utility
98Cited by
22References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 1999 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Aug 18, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1158
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer on substrate, and then forming a conductive laminate on the release layer. After the release layer is formed, the conductive laminate can be easily separated by the substrate to eventually form a flexible circuit structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.