Method for dispensing material onto a substrate
US6391378B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Jul 24, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0469
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dispensing system and method for dispensing material onto a substrate. In one embodiment, a dispensing system includes a housing, a dispensing apparatus, coupled to the housing, that dispenses a quantity of material onto the substrate, and a measuring probe, coupled to the housing, and positionable over the substrate to measure a distance from a reference point to a location on the top surface of the substrate. Another embodiment of the invention is directed to a method for dispensing material onto a top surface of a substrate using a dispensing system having a dispensing apparatus that dispenses the material at a dispensing distance from the top surface of the substrate. The method includes steps of loading a substrate onto a support plate of the dispensing system, positioning a measuring probe above the substrate at a predetermined height above the support plate, measuring a distance between the measuring probe and the top surface of the substrate, positioning the dispensing apparatus at the dispensing distance above the top surface of the substrate and dispensing material onto the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.