Rubber for hot press cushioning pad, manufacturing method thereof, hot press cushioning pad and method of manufacturing printed circuit board
US6391460B1 · kind B1 · utility
7Cited by
7References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1999 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Aug 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/677
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A rubber for a hot press cushioning pad having a value of loss tangent (tan &dgr;) in accordance with dynamic viscoelasticity measurement of at most 0.04, wherein the temperature condition is set at a hot press temperature ranging from 150° C. to 300° C., and the frequency condition is set to a time period of one press cycle ranging from 1 to 2×104 seconds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.