Non-perfluoro fluorine-containing resin molded article having low-temperature heat-sealing property
US6392138B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2001 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Apr 5, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31909
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An excellent low temperature heat sealing property is imparted to a surface of a non-perfluoro fluorine-containing resin molded article having F/C of not more than 1.8. A non-perfluoro fluorine-containing resin molded article having a surface layer portion having a low temperature heat sealing property on at least a part of the surface layer thereof; said surface layer portion having a low temperature heat-sealing property has a ratio F/C of the number of fluorine atoms to the number of carbon atoms of 0.2≦F/C≦0.9 and a ratio O/C of the number of oxygen atoms to the number of carbon atoms of 0.09≦O/C≦0.40, and a remaining portion of the surface layer has a ratio F/C of the number of fluorine atoms to the number of carbon atoms which is larger than that of the surface layer portion having a low temperature heat-sealing property and is 0.8≦F/C≦1.8.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.