Patent · US Expired

Semiconductor chip with surface covering

US6392259B1 · kind B1 · utility

3Cited by

2References

2Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Robert Allinger · Unterhaching, DE
Wolfgang Pockrandt · Pfaffenhofen an der Ilm, DE

Key dates

Filing date	Aug 19, 1999
Grant date	May 21, 2002
Priority date	—
Expiry date	Aug 19, 2019

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor chip with a surface covering includes circuits which are produced in at least one layer of a semiconductor substrate and disposed in at least one group. Supply and signal lines extend in at least one interconnect plane over at least one circuit group and have a maximum width so that a distance between each two lines is at a minimum.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.