Semiconductor package with sloped outer leads
US6392293B1 · kind B1 · utility
9Cited by
18References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 1999 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Jun 3, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Outer leads extend outward from within a package that seals a semiconductor chip, and they are connected to the semiconductor chip inside the package. Depressions are formed at the distal end portions of the outer leads. The depressions are coated with a material which is one of: Sn—Pb, Sn—Ag, Sn—Bi, Sn—Zn, Sn—Cu, Pd, Au and Ag. The depressions are V-shaped, U-shaped, or rectangular. Each depression has a depth which is 30% to 75% with respect to the thickness which the outer lead has at the cut end face of distal end thereof. The outer leads are either a gull-wing type or a straight type.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.