Process for fabricating article comprising photonic band gap material
US6392787B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Sep 1, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y20/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An improved lithographic process for fabricating articles comprising photonic band gap materials with micron-scale periodicities is provided, the process readily capable of being performed by current lithographic processes and equipment. The process involves providing a three-dimensional structure made up of a plurality of stacked layers, where each layer contains a substantially planar lattice of shapes of a first material, typically silicon, with interstices between the shapes. Each shape contacts at least one shape of an adjacent layer, the interstices throughout the plurality of layers are interconnected, and the interstices comprise a second material, e.g., silicon dioxide. Typically, the second material is etched from the interconnected interstices to provide a structure of the first material and air, this structure designed to provide a particular photonic band gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.