Heat dissipation assembly and method of assembling the same
US6392888B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2000 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Dec 20, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49359
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation assembly comprises a printed circuit board (PCB) (20), a chip (30) and a heat sink (10). The PCB comprises a grounding circuit and four through apertures (22) in the grounding circuit. The chip is mounted on the PCB, and is surrounded by the through apertures. The heat sink has four metal columns (16) depending from a bottom surface of a base (12) thereof, the columns corresponding to the four through apertures. A method of assembling the heat dissipation assembly includes the steps of: mounting a chip on a PCB; inserting metal columns of a heat sink into corresponding through apertures of the PCB; and welding the metal columns in the through apertures so that the heat sink is in intimate thermal contact with an upper surface of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.