Optical module for optical transmission and manufacturing process therefor
US6393171B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2001 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Jun 20, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4232
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The integrity of a solder jointing pad, which is used to mount an optical module, is enhanced by avoiding exposure to high temperatures used in the formation of an accompanying optical wave guide. The enhanced integrity of the solder jointing pad permits a mounting solder bump to be evenly distributed on the pad, which improves mounting position characteristics. The solder jointing pads are elongated in shape and arranged in parallel and perpendicular orientation with respect to an optical transmission path in the optical module. The enhanced integrity of the solder jointing pads permits a precise amount of solder to be introduced to the pads when mounting the optical module. The optical module can then be precisely positioned simply by varying the amount of solder introduced to the solder jointing pads. The optical device can be positioned with high accuracy by taking advantage of the self-alignment action which occurs between the molten solder bumps and the solder jointing pads. The optical module can thus be precisely positioned during manufacturing, without the need for additional adjustments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.