Optical link between electrical circuit boards
US6393184B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1999 |
| Grant date | May 21, 2002 |
| Priority date | — |
| Expiry date | Mar 31, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/803
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method of providing a point to point connection between two electrical circuit boards (23, 23′) in which a plurality of pairs of optical transceivers are provided, one transceiver of each pair being formed on a first silicon-on-insulator chip (2) in electrical contact with a first electrical circuit board (23), and the other transceiver of each pair being formed on a second silicon-on-insulator chip (2′) in electrical contact with a second electrical circuit board (23′). Each optical transceiver comprises a branched rib waveguide comprising a common stem (10, 26) and first and second branches (14, 12) extending from the common stem (10, 26); a fiber connector (20) for receiving an optical fiber (22) in communication with the stem (10, 26) of the branched rib waveguide; a light source (4) in communication with the first branch (14) of the branched rib waveguide; and a light receiver (6) in communication with the second branch (12) of the branched rib waveguide. Each pair of transceivers is linked by an optical fiber (22) connected to the stem (10, 26) of the branched rib waveguide of the first transceiver and to the stem (10′, 26) of the branched rib wavegu…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.