Microjoinery methods and devices
US6393685B1 · kind B1 · utility
61Cited by
31References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 9, 1998 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Jun 9, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/70
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A wafer level interconnecting mechanism for assembling and packaging multiple MEMS devices (modules), using microfabricated, interlocking, mechanical joints to interconnect different modules and to create miniature devices. Various devices can be fabricated using these joints, including fiber-optic switches, xyz translational stages, push-n-lock locking mechanisms, slide-n-lock locking mechanisms, t-locking joints, fluidic interconnects, on/off valves, optical fiber couplers with xy adjustments, specimen holders, and membrane stops.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.