Pressure sensor with a thermal pressure detecting element
US6393919B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2000 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Aug 24, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L11/002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor of the present invention comprises a diaphragm 6 having a first surface which receives pressure and a thermal detecting portion 3 with a heat sensitive portion disposed as to oppose the diaphragm through a spacer, wherein displacement values of the diaphragm owing to variations in pressure are detected at the thermal detecting portion as variation values of thermal equilibrium state. With this arrangement, a surface of the diaphragm which directly receives pressure from measuring fluid does not need to undergo film forming or photolithographic processes whereby main portions of thermal pressure detecting elements might be formed onto a silicon substrate by large quantities in a lump sum through simple manufacturing processes so that it is possible to improve accuracy and reliability of the thermal pressure detecting elements and to obtain a pressure sensor of low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.