Electrical interconnection for wide-array inkjet printhead assembly
US6394580B1 · kind B1 · utility
12Cited by
15References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2001 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Mar 20, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/20
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A wide-array inkjet printhead assembly includes a carrier including a substructure and a substrate mounted on the substructure, a plurality of printhead dies each mounted on the substrate, and an electrical interconnect adapted to communicate electrical signals between an electronic controller and the inkjet printhead assembly. The substrate has an electrical circuit formed therein such that the printhead dies are electrically coupled to the electrical circuit and the electrical interconnect is electrically coupled to the electrical circuit. As such, the substructure accommodates the electrical interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.