Abrasive tools for grinding electronic components
US6394888B1 · kind B1 · utility
26Cited by
20References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 1999 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | May 28, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Abrasive tools containing high concentrations of hollow filler materials in a resin bond are suitable for polishing and backgrinding of hard materials, such as ceramic wafers and components requiring a controlled amount of surface defects. These highly porous abrasive tools comprise fine grit abrasive grain, such as diamond abrasive, along with the hollow filler material and resin bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.