PCB and method for making PCB with thin copper layer
US6395378B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2001 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Jan 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24994
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention concerns a PC board with laminates for electrical circuits, the PC board comprising at least one carrier (1) and at least one copper surface layer (7), intended to, after the removal of selected parts, e.g. by etching, function as conductors on the PC board. The new thing is that the carrier at least at some parts has a surface roughness of up to mainly the same size as the thickness of the copper layer and that at least at the above named rough parts is arranged a surface levelling layer (5a,b) between the carrier (1) and the copper layer (7). Further, the invention concerns a method for producing PC board laminate for electrical circuits as above, the laminate comprising a copper layer and a carrier that has a surface roughness of mainly the same size as the thickness of the copper layer. The new thing here is that a layer (5a,b) of liquid epoxy is applied on the one or those surface parts of the carrier which in the end are to carry a copper layer, that the epoxy layer is dried and hardened, and that copper layers (7) are plated on the epoxy layers (5a,b).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.