Photosensitive resin and photosensitive resin composition
US6395452B1 · kind B1 · utility
0Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2000 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Mar 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/287
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a photosensitive resin which can give a photosensitive resin composition having excellent heat durability and excellent developability and showing excellent heat durability and excellent electric insulation reliability in a humidified state. The photosensitive resin composition contains the above photosensitive resin which is a reaction product produced by reacting an epoxy acrylate with a cyanate ester compound to obtain a reaction product (A) and reacting the reaction product (A) with a polybasic acid anhydride, and an epoxy resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.