Multi-layered substrate with a built-in capacitor design
US6395996B1 · kind B1 · utility
74Cited by
4References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2000 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | May 16, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layered substrate having built-in capacitors is used to decouple high frequency noise generated by voltage fluctuations between a power plane and a ground plane of a multi-layered substrate. At least one kind of dielectric material, which is filled in through holes between the power plane and the ground plane, with high dielectric constant is used to form the built-in capacitors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.