Printed circuit board and method for reducing radio frequency interference emissions from conductive traces on a printed circuit board
US6396000B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 11, 2000 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Sep 11, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/097
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a first helical conductive trace and a second helical conductive trace. The first helical conductive trace extends generally along a longitudinal axis of a layer of the printed circuit board. The first helical conductive trace is provided successively: along a first surface, from the first surface through the layer to a second surface, along the second surface, and from the second surface through the layer to the first surface. The second helical conductive trace extends generally along the longitudinal axis of the layer of the printed circuit board. The second helical conductive trace is provided successively: along the second surface, from the second surface through the layer to the first surface, along the first surface, and from the first surface through the layer to the second surface. A method is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.