Printed circuit board and method of making the same
US6396001B1 · kind B1 · utility
38Cited by
4References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 13, 2000 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Nov 13, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a rectangular, insulating substrate and a conductive land formed on the substrate. The land is arranged near a selected one of the longitudinal edges of the substrate. An L-shaped terminal is mounted on the substrate, so that its longer horizontal portion overlaps the land, while its shorter bent portion is engaged with a positioning groove formed in the selected longitudinal edge of the substrate. The land is caused to protrude from the overlapping horizontal portion of the terminal toward the opposite longitudinal edge of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.