Microwave packaging having patterned adhesive; and methods
US6396036B1 · kind B1 · utility
42Cited by
126References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 16, 2000 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Nov 16, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S99/14
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A microwave popcorn package is provided. The package has an inner ply and an outer ply of flexible material, such as paper, with a microwave interactive construction therebetween. The plies are bonded together with a laminating adhesive that is applied in a regular pattern of polygonal adhesive areas. This pattern occupies at least 80 square inches (516 cm2) of the surface between the plies, and provides no more than 50% adhesive coverage of that area where the pattern is located. The adhesive polygons can be squares or diamonds. A second adhesive pattern can be present in a second portion of the ply surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.