Socket pin and socket for electrical testing of semiconductor packages
US6396294B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1999 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Nov 1, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0466
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A socket pin and a socket for electrical testing of a semiconductor package suppress electrical open/short defects due to contact failure and reduce manufacturing costs. The socket pin includes: an upper portion that connects to a lead of the semiconductor package, for exchanging a signal between the semiconductor package and a tester; a body connected to the upper portion, for buffering at two points, a downward force applied by the lead of the semiconductor package to the upper portion; a lower portion connected to the body of the socket pin, the lower portion being elastically durable to the force from the upper portion and the body; and a lower socket pin connected to the lower portion, which acts as a path for transmitting or receiving an electrical signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.