Resistors for electronic packaging
US6396387B1 · kind B1 · utility
7Cited by
10References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1999 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Apr 13, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1338
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In thin layer resistors comprising a patch of a layer of resistive material on an insulating substrate and means at spaced apart locations on the patch, the resistive material is formed of 95 to 99.5 wt % of a zero valence metal and between 5 and 0.5 wt % of a dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.