Heat sink with chip die EMC ground interconnect
US6396699B1 · kind B1 · utility
7Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2001 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Jan 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for mounting a heat sink to a chip package such as a BGA type chip package or the like is disclosed. In an exemplary embodiment, ground bumps are formed on the die substrate of the chip package and on the heat mating surface of the heat sink to be attached to the package. The ground bumps formed on the die protrude into the body of dimples formed in the body of the chip encapsulation package to make thermal/electrical ground contact with the ground bumps formed on the heat mating surface of the heat sink for electrically grounding the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.