Method and apparatus for coupling circuit components
US6396712B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 12, 1998 |
| Grant date | May 28, 2002 |
| Priority date | — |
| Expiry date | Feb 12, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0329
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for connecting a combination of substrates, including chips, components, printed-circuit-boards and multiple-chip-modules to each other. The system includes a half-conductive layer forming a resistive network sandwiched between the mating substrates. The half-conductive layer has sufficient conductance to allow electrical coupling between mating electrodes on the substrates, and sufficient resistance, to stay below the maximum specified cross-talk level between non-mating electrodes. The connection system can be used to connect light emitting sources with integrated circuits, detectors to integrated circuits and two integrated circuits of the same or possibly different technology to each other. Connection of integrated circuits to printed circuit boards (PCBs) and multi-chip modules (MCMs) is also supported.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.