Printed wiring board with mounted circuit elements using a terminal density conversion board
US6397459B2 · kind B2 · utility
9Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1999 |
| Grant date | Jun 4, 2002 |
| Priority date | — |
| Expiry date | Mar 23, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49218
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density. conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.